| 摘要 |
PROBLEM TO BE SOLVED: To provide silver compound-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit at a firing temperature lower than the melting point of copper, and to provide its production method. SOLUTION: The silver compound-coated copper powder is obtained by coating each surface of silver-coated copper particles as a core material with any silver compound selected from silver oxide, silver carbonate and organic acid silver. Regarding the method for producing silver compound-coated copper powder, each surface of silver-coated copper particles is coated (fixed) with a silver compound by a wet process or a dry process. In this way, by silver thermally decomposed from the silver compound coated (fixed) to the silver compound-covered copper powder, the respective grains of the silver compound-coated copper powder are welded to each other, and thereafter, the copper grains are sintered, thus a wiring part on an electronic circuit board, a wiring part in a via hole or the like can be formed. COPYRIGHT: (C)2008,JPO&INPIT
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