发明名称 ETCHING LIQUID MANAGEMENT APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an etching liquid management apparatus, wherein the regular fixation of etching performance, the reduction in the amount of the raw liquid to be used and the remarkable reduction in a plant idling time are attained by the automatic control of the componential concentration in an etching liquid and the suitable management of liquid replenishment in an etching treatment tank, and thus the production cost is reduced. <P>SOLUTION: The etching liquid management apparatus is provided on an etching treatment device provided with: an etching treatment tank for storing a nitric acid-containing etching liquid; an etching liquid circulation mechanism for circulating the etching liquid; and an etching treatment mechanism for carrying a substrate comprising an aluminum film to be subjected to etching. The etching liquid management apparatus includes: an etching liquid sampling means; a pure water dilution means for the etching liquid subjected to sampling; a conductivity meter for measuring a conductivity value correlated with the nitric acid concentration in the etching liquid subjected to dilution; and a replenishment liquid feeding means for feeding the etching liquid treatment tank with a replenishment liquid. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008106326(A) 申请公布日期 2008.05.08
申请号 JP20060291649 申请日期 2006.10.26
申请人 HIRAMA RIKA KENKYUSHO:KK 发明人 NAKAGAWA TOSHIMOTO;SATO HISAKUNI
分类号 C23F1/20;C23F1/08;G01N9/36;G01N21/35;G01N21/3554;G01N21/3577;G01N21/359;G01N27/10 主分类号 C23F1/20
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