| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating member free from a pseudo leak when an electronic apparatus is subjected to leak testing, an electronic component housing package using the same, and the electronic apparatus. SOLUTION: A heat dissipating member 1 is formed by alternately laminating through a brazing filler 12 a first metal plate 11 and a second metal plate 10 expansive at lower temperature than that of the first metal plate 11. The fillet 12a of the brazing filler 12 with thickness in its laminating direction thicker than that in internal side is formed in the outer periphery, by constituting at least either one of the outer peripheries of the first and second metal plates 11, 10 in a different shape all through the whole periphery. A gap in the brazing filler 12 is filled with the fillet 12a of the brazing filler 12 to block its communication with the outside. COPYRIGHT: (C)2008,JPO&INPIT |
