发明名称 |
Conductive Polishing Article for Electrochemical Mechanical Polishing |
摘要 |
Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft material and, in one embodiment, the exposed surface may be planar.
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申请公布号 |
US2008108288(A1) |
申请公布日期 |
2008.05.08 |
申请号 |
US20070934878 |
申请日期 |
2007.11.05 |
申请人 |
HU YONGQI;WANG YAN;DUBOUST ALAIN;TSAI STAN D;LIU FENG Q;CHEN LIANG-YUH;EWALD ROBERT A |
发明人 |
HU YONGQI;WANG YAN;DUBOUST ALAIN;TSAI STAN D.;LIU FENG Q.;CHEN LIANG-YUH;EWALD ROBERT A. |
分类号 |
B24B39/06;B23H5/08;B23H5/10;B24B37/04;B24B53/007;B24D13/14;H01L21/3105;H01L21/321 |
主分类号 |
B24B39/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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