发明名称 Leiterplattenverbinder
摘要 A board connector (1) has a housing (10) and terminal fittings (20) penetrate through the back wall (11) of the housing (10). A board connecting portion (21) of each terminal fitting (20) penetrates through the back wall (11) and is solder-connected to a board (2). The housing (10) has a heat transfer inhibiting portion for inhibiting heat transfer to the back wall (11). The heat transfer inhibiting portion has a through-hole (13) or heat-insulating grooves (17) in the back wall (11). As a result, heat transfer to the back wall (11) is inhibited and deformation of the back wall (11) due to thermal expansion also is inhibited. Consequently, it is possible to prevent the terminal fittings (20) from separating from the board (2) and going into a state of being not solder-connected thereto.
申请公布号 DE112006001008(T5) 申请公布日期 2008.05.08
申请号 DE20061101008T 申请日期 2006.04.21
申请人 AUTONETWORKS TECHNOLOGIES LTD.;SUMITOMO WIRING SYSTEMS LTD.;SUMITOMO ELECTRIC INDUSTRIES LTD. 发明人 NAKANO, HIROSHI;HIO, MASAHIDE;OKAMURA, KENJI;HIRAI, HIROKI;HIRAMITSU, HIROOMI;HIRABAYASHI, OSAMU
分类号 H01R12/00;H01R12/50;H01R12/71;H01R12/77;H01R13/533;H01R24/00;H01R24/60 主分类号 H01R12/00
代理机构 代理人
主权项
地址