| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wire bonding apparatus capable of suppressing the wire deformation accompanying a tail cutting operation. <P>SOLUTION: The wire bonding apparatus has a capillary 2 for inserting a wire 1 thereinto, a clamper 3 capable of supporting the wire 1 in a sandwiching way, and a load sensor 6 for measuring the load applied to the wire 1. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
