| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip laminate formed by laminating a plurality of semiconductor chips, in which a connection failure of electrical connection terminals formed in the semiconductor chips hardly occurs, and the slant of an upper layer of a semiconductor chip is suppressed, and to provide a method of manufacturing the same. SOLUTION: The semiconductor chip laminate 1 is enclosed, in which a first and second semiconductor chips 2, 3 are laminated with an adhesive layer 4 therebetween, and the adhesive layer 4 has a first region 7 where contacts with the top surface 2a of a first substrate 2 and the bottom surface 3a of a second substrate 3 and includes particles 8, and a second region 9 which is arranged in the other region from the first region 7 and not includes the particles 8. A bump or a bonding wire 6 is connected to each electrical connection terminal 2b formed on the first semiconductor chip 2, and where is covered with the second layer 9 of not including the particles 8. COPYRIGHT: (C)2008,JPO&INPIT
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