THERMOSETTING RESIN, THERMOSETTING COMPOSITION CONTAINING SAME, AND MOLDED BODY OBTAINED FROM SAME

摘要

Disclosed is a thermosetting resin which is excellent in dielectric characteristics and heat resistance. Also disclosed are a thermosetting composition containing such a thermosetting resin, and a molded body and a substrate material for electronic devices obtained from such a thermosetting resin. Specifically disclosed is a thermosetting resin having a dihydrobenzoxazine ring structure represented by the general formula (I) below in the main chain. Also specifically disclosed are a thermosetting composition containing such a thermosetting resin, and a molded body and a substrate material for electronic devices obtained from such a thermosetting resin. [Chemical formula 1] (I) (In the formula (I), Ar1 represents a tetravalent aromatic group, R1 represents a hydrocarbon group having a fused alicyclic structure, and n represents an integer of 2-500.)