发明名称 RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for sealing an optical semiconductor, composed of zirconium oxide fine particles uniformly dispersed in an epoxy resin, which, when used as an optical semiconductor sealing material, has a high light beam transmittance and gives a cured product having a high refractive index, heightening light extraction efficiency through adjusting difference in the refractive indices between the cured product and an optical semiconductor material at a light-emitting wave length. SOLUTION: The composition is characterized in that it comprises the resin and the zirconium oxide particles, the zirconium oxide particle has an mean particle diameter of≥1 nm and≤30 nm, and the surface of the particle is coated with an organic compound capable of coordinating and/or bonding. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008106260(A) 申请公布日期 2008.05.08
申请号 JP20070250198 申请日期 2007.09.26
申请人 NIPPON SHOKUBAI CO LTD 发明人 HASHIMOTO TAKAAKI;YAMASAKI HAYAHIDE;SUGIOKA TAKAHISA
分类号 C08L101/00;C08K9/04;H01L23/29;H01L23/31 主分类号 C08L101/00
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