| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve wettability of solder when a semiconductor device is mounted on a substrate by coating a film on a cutting surface of a lead in the step of cutting a lead wire of a lead frame. <P>SOLUTION: In the step of cutting the leads 4a, 4b of the lead frame, side surfaces of a resin 8 are held with a lead clamper 11 and the leads 4a, 4b are cut in the depth of 1/2 to 2/3 of thickness thereof by dropping a first cutting punch 12a to the leads 4a, 4b of the portions not held with the lead clamper 11. Thereafter, the lead clamper 11 is removed and a second cutting punch is dropped on the leads 4a, 4b of the part which has been held with the lead clamper 11. Therefore, the remaining part of the part that has been cut with the first cutting punch 12a is also cut to separate the leads 4a, 4b from the lead frame. Accordingly, a plating film 4d can be deposited to almost entire surface of the cutting surfaces of the leads 4a, 4b. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
