| 摘要 |
Shown are embodiments where a process of manufacturing a semiconductor element on a semiconductor wafer is shown. The semiconductor element is obtained by dividing the function-providing semiconductor wafer into functional elements. The function-providing semiconductor wafer is, at its first main surface, mechanically coupled to a handling wafer. The thinning is carried out in the coupled state of the function-providing semiconductor wafer, and the function-providing semiconductor wafer is divided in its state coupled to the handling wafer. During or after connecting the semiconductor element to a lead frame the mechanical coupling between the semiconductor element and the corresponding part of the handling wafer is destroyed. Other embodiments are also shown.
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