INTEGRATED HEAT SPREADERS FOR LEDS AND RELATED ASSEMBLIES

摘要

A. light emitting device (LED) assembly may include an electrically insulating substrate (100a-k) and a thermally conductive layer (112a-k) on a surface (105a-k) of the insulating substrate (100a-k). A light emitting device (114a-k) may be on the thermally conductive layer (112a-k) so that the thermally conductive layer (112a-k) is between the light emitting device (114a-k) and the electrically insulating substrate (100a-k). Moreover, the thermally conductive layer may extend beyond an edge of the light emitting device (114a-k) in at least one direction a distance greater than half of a width of the light emitting device (114a-k).