| 摘要 |
A side emission type LED package is provided to maximize a heat-radiating effect by enlarging a heat radiation path of a semiconductor chip. A semiconductor chip(20) emits light. A lead frame(10) includes a pad part(11), a lead(12), and an electrode lead(13). The semiconductor chip is bonded with the pad part in a die bonding method. The lead part is separated from the pad part and is electrically connected to the semiconductor chip. The electrode lead is extended from the pad part and the lead part. A mold(30) is molded with the lead frame and includes a reflector(31) which is formed around the semiconductor chip. The reflector is filled with a charging agent(32). A heat-radiating part is connected to the pad part of the lead frame. The heat-radiating part is extended to the outside of the mold to radiate the heat.
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