| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for encapsulating an optical semiconductor, which exhibits high moldability, is high in any of light reflectance, fire resistance and hardness and can form a cured product which is excellent in the property of intercepting light from the outside because of the low light transmittance. <P>SOLUTION: The resin composition for encapsulating the photosemiconductor comprises (A) an epoxy resin, (B) a phenolic resin curing agent, (C) titanium dioxide, (D) an inorganic filler and (E) a phosphorus compound. The component (E) comprises a phosphinyl hydroquinone shown by at least structural formula (1). <P>COPYRIGHT: (C)2008,JPO&INPIT |
