| 摘要 |
PROBLEM TO BE SOLVED: To provide a target material used in an AIP (arc ion plating) process and an MS (magnetron sputtering) process, in which mechanical strength is improved, and further, the formation of droplets is suppressed, and which is suitable for forming a film having high quality. SOLUTION: In a target material comprising Al and an M component(s); wherein, the M component(s) is one or more kinds of elements selected from the group 4a, 5a and 6a metals, Si, B and S, the target material in this invention is a nitride-containing target material comprising Al and the M component(s) and the nitride of Al. COPYRIGHT: (C)2008,JPO&INPIT
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