| 摘要 |
PROBLEM TO BE SOLVED: To achieve lower cost compared with a photolithography method by enabling the uniform division of an electrode even if a separating wall is formed as an electrode dividing structure at a large size substrate. SOLUTION: A second electrode separating structure manufacturing process is composed of a thin film forming process, a curing die material printing process, a curing process and a thin film eliminating process. In the thin film forming process, a thin film 20 having low wettability with an uncured curing die material is formed on a substrate 12 on which a first electrode 13 is formed. In the curing die material printing process, the uncured curing die material 22 which is adhered in a state that an angle of contact is greater than 90°with the thin film 20 is printed in a form of a plurality of lines in a region excluding a position for forming a second electrode 16 on the thin film 20. In the curing process, the printed uncured curing die material 22 is cured. In the thin film eliminating process, a part not covered with the curing die material 22 in the thin film 20 is eliminated. COPYRIGHT: (C)2008,JPO&INPIT
|
