发明名称 FIXING STRUCTURE FOR ELECTRONIC COMPONENT AND PORTABLE ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To enable the thinning, miniaturization and easy assembling of an electronic apparatus, and to enable reliable fixing of an electronic component mounted on a flexible board. SOLUTION: An IR module (3) as the electronic component having a planar surface parallel to the planar surface of a plate-like flexible board (4) is mounted on the board, and the neighborhood of the IR module (3) in the planar surface of the flexible board (4) has a nearly rectangular shape. The flexible board (4) is so formed that one of convex portions (5) is provided on each edge portion of two opposed side faces of the rectangular portions. The IR module (3) is mounted between the locations wherein the convex portions (5) of the flexible board (4) are formed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008108982(A) 申请公布日期 2008.05.08
申请号 JP20060291711 申请日期 2006.10.26
申请人 NEC SAITAMA LTD 发明人 TAKAHASHI HIDEYUKI
分类号 H05K7/14 主分类号 H05K7/14
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