发明名称 |
SOLDER JETTING NOZZLE AND SOLDERING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a solder jetting nozzle capable of accurately and correctly jetting a predetermined quantity of molten solder to a soldering portion such as a minute distance or a minute soldering portion. SOLUTION: The nozzle comprises a base portion 82 detachably attached on a nozzle attaching member 67 in a solder bath 57 and used for supplying the molten solder 5 to a solder flow passage 83 provided in its inside; a nozzle portion 85 formed integrally with one end of the base portion 82 and having a penetrating nozzle hole 86 communicating to the solder flow passage 83; and a solder reservoir concave portion 87 formed on the tip of the nozzle portion 85 so as to communicate to the nozzle hole 86 and have a predetermined depth and an inner diameter larger than the diameter of the nozzle hole. The device spot-jets the predetermined quantity of the molten solder 5 reserved in the solder reservoir concave portion 87 by a jet pressure generated in the solder bath 57 to execute soldering. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008109034(A) |
申请公布日期 |
2008.05.08 |
申请号 |
JP20060292618 |
申请日期 |
2006.10.27 |
申请人 |
KOKI TEC CORP |
发明人 |
KAJITANI YASUHIKO;SOGA TOYOHIRO |
分类号 |
H05K3/34;B23K1/08;B23K31/02;B23K101/42 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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