发明名称 Configurable Integrated Circuit Capacitor Array Using Via Mask Layers
摘要 A semiconductor device having a plurality of layers and a capacitor array that includes a plurality of individual capacitors. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections and capacitances of the plurality of individual capacitors in the capacitor array. The semiconductor device may include a metal structure disposed within the device to provide an electromagnetic shield for at least one of the plurality of individual capacitors in the capacitor array.
申请公布号 US2008108201(A1) 申请公布日期 2008.05.08
申请号 US20070965069 申请日期 2007.12.27
申请人 TRIAD SEMICONDUCTOR, INC.;VIASIC, INC. 发明人 IHME DAVID;KEMERLING JAMES C.;COX WILLIAM D.
分类号 H01L21/20;H01G4/30;H01G4/38;H01L23/522;H01L27/08 主分类号 H01L21/20
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