发明名称 |
Configurable Integrated Circuit Capacitor Array Using Via Mask Layers |
摘要 |
A semiconductor device having a plurality of layers and a capacitor array that includes a plurality of individual capacitors. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections and capacitances of the plurality of individual capacitors in the capacitor array. The semiconductor device may include a metal structure disposed within the device to provide an electromagnetic shield for at least one of the plurality of individual capacitors in the capacitor array.
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申请公布号 |
US2008108201(A1) |
申请公布日期 |
2008.05.08 |
申请号 |
US20070965069 |
申请日期 |
2007.12.27 |
申请人 |
TRIAD SEMICONDUCTOR, INC.;VIASIC, INC. |
发明人 |
IHME DAVID;KEMERLING JAMES C.;COX WILLIAM D. |
分类号 |
H01L21/20;H01G4/30;H01G4/38;H01L23/522;H01L27/08 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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