发明名称 |
Electronic Component Mounting Apparatus And method Of Mounting Electronic Components |
摘要 |
In an electronic component mounting process for mounting electronic components ( 6 ) to a substrate, each of the electronic components having an adhesive layer on a surface to be bonded to the substrate is picked up with suction nozzle provided with individual heater, and a time taken for the mounting operation is so allotted that a first heating time of a duration from a moment when the suction nozzle comes into contact with the electronic component for picking it up till another moment immediately before it begins a mounting motion to the substrate is longer than a second heating time of a duration from the moment when the suction nozzle begins the mounting motion till another moment when it leaves the electronic component mounted to the substrate.
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申请公布号 |
US2008104831(A1) |
申请公布日期 |
2008.05.08 |
申请号 |
US20050571289 |
申请日期 |
2005.04.08 |
申请人 |
HAJI HIROSHI;OZONO MITSURU |
发明人 |
HAJI HIROSHI;OZONO MITSURU |
分类号 |
H01L21/52;H05K13/04;H01L21/00;H01L21/68;H01L21/683;H05K3/30;H05K13/00 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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