发明名称 Apparatus and methods for Cleaning and Drying of wafers
摘要 An first example method and apparatus for etching and cleaning a substrate comprises device with a first manifold and a second manifold. The first manifold has a plurality of nozzles for dispensing chemicals onto the substrate. The second manifold is attached to a vacuum source and/or a dry air/gas source. A second example embodiment is a wafer cleaning device and method that uses a manifold with capillary jet nozzles and a liquid capillary jet stream to clean substrates.
申请公布号 US2008105653(A1) 申请公布日期 2008.05.08
申请号 US20060556696 申请日期 2006.11.05
申请人 SEAH BOON MENG;ZHANG BEI CHAO;JOY RAYMOND;LAW SHAO BENG;SUDIJONO JOHN;HSIA LIANG CHOO 发明人 SEAH BOON MENG;ZHANG BEI CHAO;JOY RAYMOND;LAW SHAO BENG;SUDIJONO JOHN;HSIA LIANG CHOO
分类号 B05B13/04;B05B1/14;B08B3/08;B44C1/22 主分类号 B05B13/04
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