发明名称 |
Apparatus and methods for Cleaning and Drying of wafers |
摘要 |
An first example method and apparatus for etching and cleaning a substrate comprises device with a first manifold and a second manifold. The first manifold has a plurality of nozzles for dispensing chemicals onto the substrate. The second manifold is attached to a vacuum source and/or a dry air/gas source. A second example embodiment is a wafer cleaning device and method that uses a manifold with capillary jet nozzles and a liquid capillary jet stream to clean substrates.
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申请公布号 |
US2008105653(A1) |
申请公布日期 |
2008.05.08 |
申请号 |
US20060556696 |
申请日期 |
2006.11.05 |
申请人 |
SEAH BOON MENG;ZHANG BEI CHAO;JOY RAYMOND;LAW SHAO BENG;SUDIJONO JOHN;HSIA LIANG CHOO |
发明人 |
SEAH BOON MENG;ZHANG BEI CHAO;JOY RAYMOND;LAW SHAO BENG;SUDIJONO JOHN;HSIA LIANG CHOO |
分类号 |
B05B13/04;B05B1/14;B08B3/08;B44C1/22 |
主分类号 |
B05B13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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