SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP IN SUBSTRATE AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor package and a manufacturing method thereof are provided to improve a bonding reliability of a solder ball by forming the solder ball on a semiconductor substrate consisting of sub substrates, which are isolated from each other. A semiconductor package includes a semiconductor substrate(20), a semiconductor chip(30), and solder balls(36). The semiconductor substrate includes a first through-hole(22) and a second through-hole(26). The second through-holes are arranged to be apart from the first through-hole. The semiconductor chip includes plural pads and is arranged in the first through-hole. The solder balls are attached to respective end portions of the second through-holes. The solder ball is electrically connected to the pads. The second through-holes are arranged to surround the first through-hole. A conductive film(44) covers sidewalls of the second through-holes and is electrically connected to the pads and the solder balls.