发明名称 |
METHOD AND STRUCTURES FOR ENHANCED TEMPERATURE CONTROL OF HIGH POWER COMPONENTS ON MULTILAYER LTCC AND LTCC-M BOARDS |
摘要 |
<p>A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.</p> |
申请公布号 |
EP1568070(A4) |
申请公布日期 |
2008.05.07 |
申请号 |
EP20030783173 |
申请日期 |
2003.11.06 |
申请人 |
LAMINA CERAMICS, INC. |
发明人 |
MAZZOCHETTE, JOSEPH;TORMEY, ELLEN, SCHWARTZ;THALER, BARRY, JAY |
分类号 |
H01L23/367;H05K1/02;H05K1/05;H05K1/16;H05K3/40;H05K3/46 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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