| 摘要 |
<p>A method for fabricating an assembly module, and an assembly module and an electronic device are provided to reliably overlap the second print wiring substrate on the first print wiring substrate regardless of the print wiring substrates. The second print wiring substrate(25) is overlapped on the first print wiring substrate(23). In this case, the first recognition marks(29) are drawn on a surface of the first print wiring substrate, which are divided at an edge of the second print wiring substrate. The second recognition marks(33) are drawn on the second print wiring substrate, which are divided at an edge(25a) of the second print wiring substrate. When the both are put together, a defined geometrical shape continued by the first and second recognition marks is configured. The relative positions of the first and second recognition marks can be corrected based on deviation of the geometrical shape.</p> |
