| 摘要 |
A MEMS package and a method for its forming are described. The MEMS package has at least am MEMS device located on a flexible substrate. A metal structure surrounds the at least ooe MEMS device wherein a bottom surface of the roetal structure is attached to the flexible substrate aEd wherein a portion of the flexible substrate is foWed over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming ihe MEMS package. |
