发明名称 Package for heating in a microwave device
摘要 The present invention concerns a package comprising - a rigid container (1) with a bottom (8), lateral wall (9) and a planar rim on the top of the lateral walls with a pouring spout (12) and - a flexible lid (2) sealed on the whole periphery of the rim wherein the said lid has a low bonding strength lacquer at least on one area of the periphery of the rim.
申请公布号 EP1918220(A1) 申请公布日期 2008.05.07
申请号 EP20060123441 申请日期 2006.11.03
申请人 NESTEC S.A. 发明人 MOROZOV, SERGUEI
分类号 B65D77/20;B65D81/34 主分类号 B65D77/20
代理机构 代理人
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