| 摘要 |
A particle permeation preventing apparatus of semiconductor device manufacturing equipment is provided to decrease a semiconductor device manufacturing cost by improving stability of an exposure process. A particle permeation preventing apparatus of semiconductor device manufacturing equipment includes a particle cleaning unit(250) and a contamination checking unit(222). Before a wafer is placed in an exposure device, the particle cleaning unit automatically removes particles from a rear surface of a wafer. After a cleaning process is performed by the particle cleaning unit, the contamination checking unit determines whether the rear surface of the wafer is contaminated by using an electron beam. The particle cleaning unit includes a brush unit(240) and an air blowing unit(235). The brush unit brushes off the rear surface of the wafer, when the wafer is transferred through a TSU(Temperature Stabilization Unit). The air blowing unit is arranged close to the brush unit and blows away the particles dropping from the rear surface of the wafer.
|
