| 摘要 |
An LED(Light Emitting Diode) package is provided to obtain a high optical output by preventing an increase of junction temperature of an LED chip. A plurality of LED chips(41,43,45) are formed to emit light having a peak wavelength less than 350 nm. A heat radiating member is formed to emit heat radiated from the LED chips. A sealing agent is formed with a silicon resin for sealing the LED chip. The heat radiating member includes a heat-sink supporting ring(13) including at least two connective terminals and a heat-sink to be inserted into the heat-sink supporting ring. The LED chips are arranged on an upper part of the heat-sink. Two or more lead terminals are separated from the heat-sink supporting ring and the heat-sink to be arranged at both sides of the heat-sink supporting ring. A package body is formed to mold and support the heat-sink supporting ring and the lead terminals. |
