发明名称 PORTABLE BONDING DEVICE AND BONDING METHOD
摘要 <p>This invention provides a portable bonding device that, despite a portable type, can substantially completely remove air bubbles from an adhesive layer and, at the same time, can eliminate the need to hold the device by a worker during bonding work. The portable bonding device is a portable bonding device for bonding an adherend to a bonding base material with the aid of a heat-curable resin adhesive at site and is characterized by comprising a cylindrical body, in which only the lower end is open, a vacuum pad, which is provided on the lower end of the cylindrical body and comes into contact with the bonding base material to constitute a substantially hermetically sealed chamber surrounded by the cylindrical body between the piston and the bonding base material, a pressing member, which is provided within the cylindrical body and is movable between the action position at which the adherend disposed on the bonding base material is pressed and nonaction position distant from the adherend, heating means provided within the cylindrical body, for heating the adhesive interposed between the adherend disposed on the bonding base material and the bonding base material, and vacuum means for evacuating the chamber.</p>
申请公布号 EP1801177(A4) 申请公布日期 2008.05.07
申请号 EP20050785799 申请日期 2005.09.15
申请人 DOW CORNING TORAY CO., LTD.;SO-KEN CO., LTD 发明人 TANAKA, KOJI;HIRAI, KAZUO;HORIOKA, NOBUYOSHI;KAWAKAMI, TAKASHI
分类号 C09J5/00;C09J183/04 主分类号 C09J5/00
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