发明名称 ELECTRONIC COMPONENT PLACEMENT METHOD
摘要 In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections (4A, 4B) which supply electronic components using a plurality of mounting heads (8A, 8B) which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate (3) in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.
申请公布号 KR20080039341(A) 申请公布日期 2008.05.07
申请号 KR20077029609 申请日期 2006.08.16
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SUMI HIDEKI;NODA TAKAHIRO
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址