| 摘要 |
A substrate cutting apparatus and a substrate cutting method using the same are provided to reduce damage of a cell caused by misalignment in a substrate aligning process. A scribing unit(110) includes a wheel(115) for forming a prearranged cut line. A breaking unit(120) includes a break bar(125) for applying an impact to the prearranged cut line. A body(150) includes the scribing unit and the breaking unit which are integrally connected. An air supply unit(130) for providing air is positioned between the scribing unit and the breaking unit. An impact absorbing member(128) made of an impact absorbing material including rubber, plastic or polymer for absorbing an impact is provided on an end of the break bar. The wheel and the break bar are disposed on the same line. |
