发明名称 |
DOUBLE SIDE POLISHING METHOD FOR WAFER |
摘要 |
<p>There is provided a double-side polishing method for a wafer of sandwiching a wafer held in a carrier between upper and lower turn tables each having a polishing pad attached thereto and simultaneously polishing both surfaces of the wafer while supplying a slurry to a space between the upper and lower turn tables from a plurality of slurry supply holes provided in the upper turn table, wherein a polishing amount at an outer peripheral portion of the wafer to be polished is adjusted and outer peripheral sag of the wafer is suppressed by supplying the slurry in such a manner that an amount of the slurry supplied from the slurry supply holes provided on an outer side relative to the center of rotation of the upper turn table becomes larger than an amount of the slurry supplied from the slurry supply holes provided on an inner side relative to the same at the time of polishing both the surfaces of the wafer. As a result, the double-side polishing method which can suppress occurrence of the outer peripheral sag of the wafer when the wafer is subjected to double-side polishing can be provided.</p> |
申请公布号 |
EP1918069(A1) |
申请公布日期 |
2008.05.07 |
申请号 |
EP20060767473 |
申请日期 |
2006.06.28 |
申请人 |
SHIN-ETSU HANDOTAI CO., LTD. |
发明人 |
UENO, JUNICHI;KOBAYASHI, SYUICHI |
分类号 |
B24B37/00;B24B37/08;B24B57/00;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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