发明名称 |
METHOD OF MANUFACTURING CAPACITOR USING ATOMIC LAYER DEPOSITION |
摘要 |
A method for manufacturing a capacitor using an atomic layer deposition method is provided to simplify a manufacturing process and to reduce thermal stress by removing a heat treatment process. A lower electrode(128) is formed on a substrate(100). A perovskite seed dielectric layer(130) is crystallized on the lower electrode by using an atomic layer deposition method. A bulk dielectric layer(131) is crystallized on the perovskite seed dielectric layer by using the atomic layer deposition method. An upper electrode(132) is formed on the bulk dielectric layer. The perovskite seed dielectric layer includes a strontium titanium oxide or a calcium titanium oxide.
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申请公布号 |
KR20080038713(A) |
申请公布日期 |
2008.05.07 |
申请号 |
KR20060105978 |
申请日期 |
2006.10.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LIM, JAE SOON;CHO, KYU HO;LEE, KWANG HEE;KIM, KI CHUL |
分类号 |
H01L21/205;H01L27/04;H01L27/108 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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