| 摘要 |
The invention relates to coating masses for planar components, hybrids and SMD components, containing at least one binder or binder mixture, which may be hardened at 60 °C-120 °C, preferably 70 °C-110 °C, in particular 80 °C-90 °C a method for production and use thereof for planar components in electronics, hybrids, SMD components and assembled circuit boards.
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