发明名称 Method for forming metal wires by microdispensing pattern
摘要 A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
申请公布号 US7367118(B2) 申请公布日期 2008.05.06
申请号 US20040864331 申请日期 2004.06.10
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHENG KEVIN;YANG MING-HUAN;CHIU WAN-WEN;CHANG JANE
分类号 H05K3/10;C23C18/16;C23C18/18;C23C18/30;H01L29/10;H05K3/18 主分类号 H05K3/10
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