| 摘要 |
An image sensor module includes a flexible printed circuit board having an upper surface, which is formed with electric circuits and a lower surface. A passive component is arranged on the upper surface of the circuit board. A substrate has a first surface, a second surface and a penetrated hole. The second surface of the substrate is mounted on the upper surface of the circuit board so that the passive component is located within the penetrated hole. A chip is mounted on the first surface of the substrate, and is located onto the penetrated hole. Wires are electrically connected to the chip and the substrate. A lens holder is mounted on the first surface of the substrate and formed with an internal thread. A lens barrel is formed with an external thread screwed on the internal thread and is formed with an opening, an aspheric lens and an infrared filter.
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