发明名称 Application and removal of thermal interface material
摘要 A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.
申请公布号 US7367195(B2) 申请公布日期 2008.05.06
申请号 US20060599671 申请日期 2006.11.14
申请人 INTEL CORPORATION 发明人 SAUCIUC IOAN;CHRYSLER GREGORY M.
分类号 F25B21/02;F28D15/02;H01L23/38;H01L23/42 主分类号 F25B21/02
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