发明名称 Single transistor DRAM cell with reduced current leakage and method of manufacture
摘要 A single transistor planar DRAM memory cell with improved charge retention and reduced current leakage and a method for forming the same, the method including providing a semiconductor substrate; forming a gate dielectric on the semiconductor substrate; forming a pass transistor structure adjacent a storage capacitor structure on the gate dielectric; forming sidewall spacer dielectric portions adjacent either side of the pass transistor to include covering a space between the pass transistor and the storage capacitor; forming a photoresist mask portion covering the pass transistor and exposing the storage capacitor; and, carrying out a P type ion implantation and drive in process to form a P doped channel region in the semiconductor substrate underlying the storage capacitor.
申请公布号 US7368775(B2) 申请公布日期 2008.05.06
申请号 US20040903084 申请日期 2004.07.31
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HUANG CHIH-MU;KING MINGCHU;CHANG YUN
分类号 H01L29/72 主分类号 H01L29/72
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