发明名称 Multilayer electronic circuit device
摘要 An electronic control device includes a multilayered flexible substrate and first to fourth spacers disposed in a casing. The multilayered flexible substrate, including first to third rigid substrate portions, is folded in a multilayered arrangement in such a manner that each rigid substrate portion is sandwiched between two spacers. The first rigid substrate portion is disposed at the lowest position to arrange a lowermost layer. The second rigid substrate portion is folded upward relative to the first flexible portion by 180 degrees to arrange an intermediate layer. The third rigid substrate portion is folded upward relative to the second flexible portion by 180 degrees to arrange an uppermost layer. The card edge connectors are laminated or layered with predetermined gaps and positioned in a case opening.
申请公布号 US7369415(B2) 申请公布日期 2008.05.06
申请号 US20050032137 申请日期 2005.01.11
申请人 DENSO CORPORATION 发明人 KOJIMA AKIYOSHI
分类号 H05K9/00;H02G3/16;H05H7/14;H05K1/02;H05K1/18;H05K7/02;H05K7/14;H05K7/20 主分类号 H05K9/00
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