发明名称 |
Resin composition, prepreg, laminate, and semiconductor package |
摘要 |
A resin composition which can be used to form a prepreg having sufficient flexibility to prevent cracking from occurring therein is provided. Further, a prepreg having sufficient flexibility to prevent cracking from occurring, a prepreg having excellent workability even in the case where the resin composition in the prepreg is in an uncured state, and a laminate provided with such a prepreg are also provided. The resin composition is used to form a sheet-shaped prepreg by impregnating a base material with the resin composition, and the composition comprises a first thermosetting resin, a second thermosetting resin having a lower weight average molecular weight than that of the first thermosetting resin, a curing agent, and a filler. The prepreg is formed by impregnating a base sheet material with the resin composition described above. The laminate is formed by laminating a metallic foil on the prepreg and then molding them by heating under pressure. A semiconductor package is manufactured by mounting an IC chip on a prepreg on which the metallic foil has been laminated. |
申请公布号 |
US7368497(B2) |
申请公布日期 |
2008.05.06 |
申请号 |
US20040789914 |
申请日期 |
2004.02.27 |
申请人 |
SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
HOSOMI TAKESHI;YAMASHITA MASAKO;BABA TAKAYUKI;YABUKI KENTARO |
分类号 |
C08K3/36;B05B5/00;B32B5/16;C08J5/24;H05K1/03 |
主分类号 |
C08K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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