发明名称 Interface apparatus for testing IC package
摘要 An interface apparatus comprises a plurality of contact pins, an upper housing, a lower housing, a plurality of conductive members and a resilient supporter. The upper housing holds the contact pins with their upper end portions upwardly projecting from the upper housing, respectively. The resilient supporter is held by the lower housing and movably supports the upper housing. Upon a test of an IC package, package terminals of the IC package are brought into contact with the upper end portions of the contact pins generally by the resilient supporter; its spring force is independent from the sizes of the package terminals, resulting reliable contacts between the contact pins and the package terminals even if the package terminals become smaller.
申请公布号 US7367813(B2) 申请公布日期 2008.05.06
申请号 US20060517344 申请日期 2006.09.08
申请人 ELPIDA MEMORY, INC. 发明人 MATSUO SHOICHI
分类号 H01R12/00 主分类号 H01R12/00
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