| 摘要 |
A semiconductor laser element and a semiconductor laser element package having a light-blocking plate are provided to simplify a manufacturing process by forming the light-blocking plate on a sub-mount or a stem of the package instead of a light emitting structure. A semiconductor laser element comprises a light emitting structure(100), a sub-mount(200), and a light-blocking plate(210). The light emitting structure includes a substrate(110), and a first clad layer, an active layer(130), and a second clad layer which are laminated on the substrate, sequentially. The light emitting structure is bonded on the sub-mount. The light-blocking plate is formed on the sub-mount and prevents leakage of the light through a side of the substrate(110b) toward a light emitting surface(101) for the light emitting structure by blocking the side of the substrate when the light emitting structure is bonded on the sub-mount.
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