| 摘要 |
A method for manufacturing a release sheet is provided to fabricate minute precision components and semiconductor frames having various shapes by restraining an extension in a strip length direction when forming a thin section. A release strip(6) is formed in a curved strip(4) having a curved thin section(t) and a rear section(T) through the pressurization of curved-surface protrusions on upper and lower surfaces of left and right widths of a material strip(3). The release strip is formed in a bending strip(5) having a bending thin section(t') and a rear section through the pressurization of bending protrusions(1',2') on both outer sides of the curved thin section of the curved strip. The release strip includes a rear section and a plane thin section(t") in a strip width direction by correcting the bending thin section at both sides of the bending strip with the plane thin section. |
