| 摘要 |
<p>In a method and system for fabricating a leadframe (100), a thickness of bondable areas (150, 154) of the leadframe is reduced. A plating finish (160) is applied to a surface of the leadframe, including the surface of the bondable areas to provide a smooth texture. A selective portion (102) of the surface is removed by grinding off the plating finish on the selective portion to provide a rough texture while substantially preserving the smooth texture on the bondable areas. Removal of the plating finish on the selective portion causes the selective portion to form the rough texture, compared to the smooth texture of the plating finish. The rough texture provides increased adhesion to a polymeric compound compared to an adhesion provided by the smooth texture. Bondability of the bondable areas is maintained by preserving the smooth texture of the plating finish.</p> |
