发明名称 SUBSTRATE SUPPORT STRUCTURE WITH RAPID TEMPERATURE CHANGE
摘要 <p>The present invention relates to semiconductor reaction chambers including a substrate support structure with rapid temperature change capabilities. The methods and components of the present invention may be used substrate deposition and related processes where varied temperatures are used. In accordance with the advantages of the present invention, the reaction chambers and substrate support structures of the invention can change temperature within a short duration of time, thereby allowing quicker processing times. The substrate support structures generally include a susceptor surface formed from a material having configured so as to allow for rapid temperature change of greater than about 10 °C/sec.</p>
申请公布号 WO2008051670(A2) 申请公布日期 2008.05.02
申请号 WO2007US79132 申请日期 2007.09.21
申请人 APPLIED MATERIALS, INC.;BOUR, DAVID;WASHINGTON, LORI, D. 发明人 BOUR, DAVID;WASHINGTON, LORI, D.
分类号 C23C16/00 主分类号 C23C16/00
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