EPOXY RESIN COMPOSITION AND CURED PRODUCT

摘要

Disclosed is an epoxy resin composition containing an epoxy resin, a curing agent for epoxy resins, and a modifying agent. This epoxy resin composition is characterized in that a monofunctional crystalline epoxy resin (B) containing a C<SUB>10</SUB>-C<SUB>20</SUB> aromatic structure and having a melting point of 40-120°C is contained as a modifying agent component in an amount of 2-50 parts by weight per 100 parts by weight of an epoxy resin (A). Consequently, the epoxy resin composition exhibits excellent fluidity, heat resistance, moisture resistance, low thermal expansion, flame retardance and low stress property (low elasticity), and is thus useful for semiconductor encapsulating materials, molding materials, laminate materials, powder coating materials and adhesive materials.