发明名称 |
SYSTEM, APPARATUS AND METHODS FOR BOARD COOLING |
摘要 |
Cooling of printed circuit boards and electronic components mounted to such boards through evaporative cooling is achieved using a system, an apparatus and methods of water mist rapid cooling. The system and the apparatus comprise one or more spray assemblies, each including a water distribution manifold assembly and a multiple of spray nozzles connected to the manifold assembly, to deliver water spray mists to printed circuit boards during reflow processing. Spray assemblies are incorporated in a reflow oven to define an evaporative cooling zone. As heated printed circuit boards are conveyed through an evaporative cooling zone, one or more spray assemblies spray boards with water spray mists to lower elevated temperatures of boards, components, and solders to thereby ensure solder solidification to form solder joints and interconnections and sufficient board cooling for safe handling. The system, apparatus and methods are particularly suited for high temperature reflow soldering, such as reflow processes using lead-free solders.
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申请公布号 |
WO2008030272(A9) |
申请公布日期 |
2008.05.02 |
申请号 |
WO2007US07606 |
申请日期 |
2007.03.28 |
申请人 |
HELLER INDUSTRIES;NEVILLE, JAMES, E.;SUN, YUSHING, ERIN |
发明人 |
NEVILLE, JAMES, E.;SUN, YUSHING, ERIN |
分类号 |
H05K7/20;H05K1/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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