发明名称 |
MICROELECTRONIC DEVICES HAVING INTERMEDIATE CONTACTS FOR CONNECTION TO INTERPOSER SUBSTRATES, AND ASSOCIATED METHODS OF PACKAGING MICROELECTRONIC DEVICES WITH INTERMEDIATE CONTACTS |
摘要 |
Microelectronic devices having intermediate contacts, and associated methods of packaging microelectronic devices with intermediate contacts, are disclosed herein. A packaged microelectronic device configured in accordance with one embodiment of the invention includes a microelectronic die (310) attached to an interconnecting substrate (420). The microelectronic die includes an integrated circuit electrically coupled to a plurality of terminals. Each of the terminals is electrically coupled to a corresponding first contact on the die with an individual wire-bond (314). Each of the first contacts on the die is electrically coupled to a corresponding second contact (422) on the interconnecting substrate by a conductive coupler such as a solder ball (580). |
申请公布号 |
KR20080038210(A) |
申请公布日期 |
2008.05.02 |
申请号 |
KR20087005728 |
申请日期 |
2006.08.09 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
FEE SETHO SING |
分类号 |
H01L23/31;H01L21/60;H01L23/498;H01L23/50 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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