| 摘要 |
A printed circuit board and a flip chip package using the same are provided to reduce a stress applied to a bump joint by using a protrusion section extended from a bump land by a certain length. A first metal wire(210) is formed on a surface of a dielectric. The first metal wire has a bump land(216) and a protrusion section(232) extended from the bump land, which are formed on an end thereof. A second metal wire is formed on the other surface of the dielectric. The second metal wire has a ball land on an end thereof. A via metal wire is formed in the dielectric to connect the first metal wire to the second metal wire. Solder resists(202) are formed on a surface and the other surface of the dielectric to expose the bump land and the ball land, respectively. The first and second metal wires and the via metal wire are made of copper. The protrusion section of the first metal wire is extended toward an edge of the dielectric. |
