METHODS AND DEVICES FOR COOLING PRINTED CIRCUIT BOARDS
摘要
<p>Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. The method can include coating a layer of diamond-like carbon (DLC) over at least a portion of the printed circuit board in order to accelerate movement of heat away from the heat source. Various heat sources may be present on a printed circuit board, hi one aspect, the heat source can be an active heat source such as a heat- generating electronic component.</p>
